Dicing Saw

Model 1006
Type commercial
Equipment Characteristics
Batch sizes 50 .. 100 mm: 1
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
10 .. 100 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
0.25 .. 511 mil
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 mm, 75 mm, 100 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, fused silica, Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
0.25 .. 511 mil