Tencor FLX 2908 Wafer Curvature (Stress) Measurement

Model FLX 2908
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 125 mm: 1, 150 mm: 1, 200 mm: 1, 75 mm: 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
75 mm, 100 mm, 125 mm, 150 mm, 200 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 600 µm