AG Heatpulse 210 Rapid Thermal Processing Systems

Model
Type
Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
quartz chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm