Wafer dicing saw |
|
|---|---|
| Model | 1100 |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 150 mm: 1, 50 mm: 1 |
| MOS clean | no |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 100 mm, 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, glass (category), Pyrex (Corning 7740), silicon |