EV 501 bonder |
|
|---|---|
| Model | 501s |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 2 |
| MOS clean | no |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1500 µm |