Plasma Therm 72 RIE |
|
|---|---|
| Model | |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 3, 150 mm: 1, 200 mm: 1, 75 mm: 4 |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
75 mm, 100 mm, 150 mm, 200 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat |
| Wafer holder Device that holds the wafers during processing. |
plate |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), quartz (single crystal), sapphire, silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |