Michael A. Huff, Ph.D. mhuff@mems-exchange.org
Michael Huff

Dr. Michael A. Huff is Founder and Director of the MNX in Reston, Virginia. The MNX was established as a national-level program to provide access to MEMS implementation resources as well as to develop manufacturing techniques to help advance the technology. The MNX continues to grow at a rapid rate and serves over 6,000 customers from over 900 organizations around the country.

Dr. Huff has held a variety of notable positions, from industry to academia, working to advance and mature MEMS and Nanotechnology for commercial applications. Prior to establishing the MNX, Dr. Huff was on the faculty in the Department of Electrical Engineering at Case Western Reserve University (CWRU) in Cleveland, Ohio. At CWRU his research was focused on developing MEMS microfluidic components for healthcare and defense applications, including a novel MEMS-based insulin pump, which received national attention and was portrayed in the book One Digital Day by Rick Smolan.

Before joining the faculty at CWRU, Dr. Huff held the position of Technical Fellow at the Baxter Healthcare Corporation in Chicago, Illinois and directed Baxter's corporate-wide efforts in applying MEMS technology to novel medical devices, which resulted in several new products. At Baxter, he was also very active in managing product development in more mature technology domains such as infusion pumps, blood warmers, etc., as well as conducting technical due diligence on potential acquisitions.

Dr. Huff has actively participated in MEMS research and development for over twenty-five years and has published numerous papers on MEMS devices and fabrication technologies. Dr. Huff holds more than a dozen patents and has several others pending. His principal technological accomplishments in the MEMS technology domain include: the development of shape-memory materials for high force and large displacement actuators; the development of many novel microfluidic devices and systems; the evelopment of shape-memory alloy as an extremely high-gauge factor strain sensing material; the advancement of silicon wafer bonding as a MEMS fabrication technology; the development of silicon wafer bonding as a technique for MEMS packaging; the development of a thick polysilicon surface micromachined process for higher force or higher capacitive sense applications; the development of a Bond and Etch Back Silicon-On-Insulator (BESOI) process; the demonstration and determination of compressive stress levels in Boron etch stop layers; the development and demonstration of thermal micromachined devices having one of the broadest thermal bandwidths ever reported; commercialization of several MEMS microfluidic devices; the development of MEMS on LTCC for microwave and RF applications; the development of deep, high-aspect ratio glass and quartz etching; development of low-cost long-wavelength infrared focal-plane array imagers; the demonstration of distributed fabrication of MEMS as a viable method to implement high-quality devices; and many others.

Dr. Huff received his undergraduate degree in Electrical Engineering with Highest Honors. He spent several years working at the Missile Systems Division of Raytheon Corporation where he designed the front-end signal acquisition system for the Patriot Missile Platform. He was awarded the M.S. in Electrical Engineering and Computer Science and simultaneously the M.S. in Material Science and Engineering with a specialization in Electronic Materials from the Massachusetts Institute of Technology in Cambridge, MA. His thesis was under the supervision of one of the most notable pioneers of MEMS technology, Prof. Roger Howe, and involved the design and fabrication of a thermally-isolated microstructure for tin-oxide gas sensors. This thesis work was supported by General Motors Research in Warren, Michigan. Dr. Huff was awarded a Ph.D. in Electrical Engineering and Computer Science from MIT. His thesis involved the design and fabrication of a wafer-bonded electrostatically-actuated pressure-balanced microvalve that could operate at very high fluid pressure levels, and was supported by the Robert Bosch Company in Stuttgart, Germany. He also developed a novel threshold pressure switch using wafer bonding that employed mechanical hysteresis in a plastically-deformed thin silicon diaphragm. His thesis pioneered the now commonly used fabrication technique of silicon wafer bonding for MEMS fabrication. At MIT, he was also a finalist in the internationally famous MIT 10K Entrepreneur Competition.

Dr. Huff received a 1995 Glennan Award from CWRU and his research achievements have been cited in many popular and technical publications including the Los Angles Times, Cleveland Magazine, Crain’s Business, One Digital Day, CWRU Magazine, etc. Dr. Huff is a member of numerous professional and honorary societies including: Sigma Xi, Eta Kappa Nu, IEEE, ASME, Electrochemical Society, ASTM, Optical Society of America, and the SPIE. Dr. Huff also served on the Technical Program Committee to the Solid-State Sensor and Actuator Workshop in 2006, 2008, and 2010, served on the Technical Program Committee to International Solid-State Sensor and Actuator Conference (Transducers) in 2007 and 2009, and has served as the Chair of the North American Standards Committee on MEMS technology in SEMI in 2004 and 2005. He also served on the Joint Commission for Technology in Science (JCOTS) Nanotechnology working group, which advises the Commonwealth of Virginia’s legislature on issues related to advancing Nanotechnology in the state. Dr. Huff also serves on the advisory committee for the College of Science at George Mason University.

Dr. Huff has written several book chapters on MEMS technology including:

Fundamentals of Microelectromechanical Systems
Chapter 23 of the Semiconductor Manufacturing Handbook, editor Hwaiyu Geng, McGraw-Hill, New York, 2005. (reference).
Process Integration
Chapter 14 of the MEMS Materials and Processing Handbook, editors R. Ghodssi and P. Lin, Springer Press, New York, to be published in January 2011. (reference).
BioMEMS and Biomaterials for Medical Applications
Biomaterials Science: An Integrated Clinical and Engineering Approach, edited by Yitzhak Rosen and Noel Elman, CRC Press, Boca Raton, FL, to be published in 2010.

Dr. Huff is responsible for overall management of the MNX and is actively involved in lending his expertise and knowledge on various MNX customer development efforts.

Mehmet Ozgur, Ph.D. ozgur@mems-exchange.org
Mehmet Ozgur

Dr. Mehmet Ozgur is an engineering professional in charge of engineering services and customer relations at the MNX. Dr. Ozgur received the B.S. and M.S. degrees in Electrical Engineering from Bilkent University, Ankara, Turkey, in 1994 and 1996, respectively, and the D.Sc. degree in Electrical Engineering from the George Washington University, Washington, D.C in 2000. Dr. Ozgur is very active in the development and characterization of millimeter-wave and microwave devices using MEMS technology and monolithic integration of high quality reconfigurable microwave components with low and high frequency electronics. Through his thesis and subsequent work, Dr. Ozgur has become a leading expert in MEMS microwave devices and systems. Dr. Ozgur is responsible for providing engineering expertise to MNX customers.

Michael Pedersen, Ph.D. mpedersen@mems-exchange.org
Michael Pedersen

Dr. Michael Pedersen is an engineering professional in charge of special projects at the MNX. Dr. Pedersen has a Ph.D. degree in Electrical Engineering from the University of Twente, The Netherlands and a M.Sc. degree in Electrical Engineering from the Technical University of Denmark. He has more than ten years of hands-on experience in MEMS technology from industrial and academic settings and is considered one of the world's foremost experts in acoustical MEMS devices. His most immediate industrial work assignment was at Knowles Electronics in Itasca, llinois where he developed MEMS acoustical devices now being sold as microphones in the cell phone and hearing aid markets. Dr. Pedersen is responsible for providing expertise to MNX customers on special projects.

Paul Sunal, Ph.D. psunal@mems-exchange.org
Paul Sunal

Dr. Paul Sunal is an engineering professional in charge of foundry operations and thin-film technologies at the MNX. Dr. Sunal graduated with his bachelor's degree from the University of Florida in Materials Science and Engineering with a specialty in ceramic engineering. Following his bachelor's degree, he completed a Master of Science degree program in Engineering Science and Mechanics at the Pennsylvania State University. Employed as a process engineer for the MEMS and Nanotechnology Exchange in the Solid State Electronics Laboratory at the University of Michigan, he worked for three years before returning to the Pennsylvania State University to complete his Ph.D., also in Engineering Science and Mechanics.

During his time at Penn State, Dr. Sunal investigated various aspects of engineered thin film morphologies, specifically, micro- and nanostructured thin films such as sculptured thin films (STFs) and metal/nitride nanocomposites. His work focused on determining the level of control over the resulting structure at all length scales (macro-, micro-, nanoscale) and methods of thin film characterization. Part of his time at Penn State was spent fabricating Pd hydrogen gas sensors upon permeable, heated MEMS platforms that allowed regeneration of the sensors, thereby increasing their lifetimes and sensitivity. Dr. Sunal is responsible for providing engineering and fabrication expertise to MNX customers.