on front 5x i-line stepper photolithography Down |
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Process characteristics: |
Alignment tolerance Registration of CAD data to features on wafer |
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Min feature size Minimum feature size in the design that will be written on the wafer. (the corresponding feature size on the mask should be 5 times larger.) |
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Perform edge bead removal |
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Perform hardbake Hardbake or UV stabilization is optional for AZ5214E only. Neither hardbake nor UV stabilization is available for AZ 9245. |
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Perform linewidth metrology Two measurement per wafer |
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Perform microscope inspection 30 mins inspection per wafer |
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Perform stylus profilometry One measurement per wafer, for features >40um in width. |
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Resist thickness |
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Batch size |
1 |
Design size Size of design on mask |
15.5 mm |
Magnification |
5 |
Wafer size |
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Comments: |
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