Process Hierarchy

on front
  5x i-line stepper photolithography
Process characteristics:
Alignment tolerance
Registration of CAD data to features on wafer
Alignment tolerance*
Registration of CAD data to features on wafer, must be 0.3 .. 5 µm
0.3 .. 5 µm
Min feature size
Minimum feature size in the design that will be written on the wafer. (the corresponding feature size on the mask should be 5 times larger.)
Min feature size*
Minimum feature size in the design that will be written on the wafer. (the corresponding feature size on the mask should be 5 times larger.) , must be 0.8 .. 10 µm
0.8 .. 10 µm
Perform edge bead removal
Perform edge bead removal*
yes no
Perform hardbake
Hardbake or UV stabilization is optional for AZ5214E only.
Neither hardbake nor UV stabilization is available for AZ 9245.
Perform hardbake*
Hardbake or UV stabilization is optional for AZ5214E only. Neither hardbake nor UV stabilization is available for AZ 9245.
Perform linewidth metrology
Two measurement per wafer
Perform linewidth metrology*
yes no
Two measurement per wafer
Perform microscope inspection
30 mins inspection per wafer
Perform microscope inspection*
yes no
30 mins inspection per wafer
Perform stylus profilometry
One measurement per wafer, for features >40um in width.
Perform stylus profilometry*
yes no
One measurement per wafer, for features >40um in width.
Resist thickness
Resist thickness*
Batch size 1
Design size
Size of design on mask
15.5 mm
Magnification 5
Wafer size
Wafer size
Comments:
  • Lens Type 5:1 Tropel 2235, 22 mm dia, i-line 365 nm, 0.35NA
    Illumination Uniformity - 4%
    System Resolution - 0.7 microns
    Depth of focus - 1.5 microns
    Autofocus lens column movement - 10 mils
    system precision - 0.15 microns 3 sigma
    global alignment system registration - 0.3 microns 3 sigma
    max dye size - 22mm cicular lens dia => 15.56 square
    10 Reticle capacity
    6 inch wafers
    MDFAS - Micro Dark Field Alignment System for improved overlay - maps individual dye to a best fit scenario