1. Overview

Masks to be used in processing performed by the MEMS and Nanotechnology Exchange may be made through the MEMS and Nanotechnology Exchange fabrication network or externally. In either case, there are a number of requirements that must be satisfied in order to ensure painless processing (such as ensuring compatibility with lithography tools used). This document details some of the information that should be considered when performing mask layout and when having masks made. Much of the information contained here is general, and pertains to most MEMS fabrication; however, some of the material covers topics specific to distributed MEMS fabrication within the MEMS and Nanotechnology Exchange fab network. If you have any questions about any of the material contained here, please contact the MEMS and Nanotechnology Exchange, as we would like to evolve and improve this document with community participation.

This document starts with a simple introduction to lithography as is typically used in the fabrication of MEMS devices. The introduction is intended for those less familiar with MEMS lithography and is intended to be a practical introduction. The basics of lithography are covered in order to explain some of the nuances of mask layout. The goal is to enable you to follow some basic layout conventions and to be able to provide the information necessary to have a mask set made for use within the MEMS and Nanotechnology Exchange fab network. The experienced user may wish to gloss over the introductions background text or skip to the mask rules and guidelines later in this document.