MEMS and Nanotechnology Exchange
- Wafer descriptions
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The collection of wafers to be processed in a run must be described
using one or more wafer descriptions.
A wafer description includes the wafer material, dimensions, and
other information that is critical for planning your run.
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For your convenience, we offer wafers from our inventory.
You can choose from our inventory if you like (and plan to pay
for them if and when the run is ready for your final approval).
If you don't want wafers from our inventory because you
are supplying the wafers yourself, or perhaps because you
don't find what you want in our inventory, click on the
link to enter a "custom wafer description."
- Purchasing wafers
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Choosing wafer descriptions from our inventory does not actually
purchase or reserve the wafers for you.
Because our inventory is changing weekly, the number of wafers
of a certain type that you request may not be available
when your run is ready for the actual processing to begin.
You can, however, purchase the wafers at any time to avoid
potential delays. You will find payment instructions on the run card
after adding wafers from our inventory.
- Pre-processed wafers
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If your wafers are pre-processed then it is extremely important that
you provide a complete description of the preceding processing. If
the pre-processing left any alignment marks on the wafers that are
intended for mask alignment, then you should describe these alignment
marks.
- Wafer sides and wafer orientation
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Sometimes it is important to distinguish the front and back of wafers
involved in your process run. For example, some processes may affect
each side of a wafer differently. The terms "front" and "back" are used
consistently throughout a process run to refer to a specific side of the
wafer. This means the "front" of the wafer does not change from one
process step to the next. The same deposition process may deposit
material on the front of the wafer in one step and the back of the wafer
in the next step, depending (for example) on how the wafers are placed
in the deposition equipment. The side of the wafer to process may be
selected when editing the process step.