The MEMS Exchange is pleased to announce that three new and potentially breakthrough process modules are being made available through the MEMS Exchange. These new process modules are listed below and will provide to MEMS Exchange customers an even larger set of capabilities to implement their MEMS devices. These new process modules include: a complete process technology that allows the integration of MEMS devices with state-of-the-art microelectronics (e.g., 0.35 um CMOS); highly innovative surface treatments that will reduce or eliminate stiction effects in MEMS devices; and a new diamond Chemical Vapor Deposition (CVD) technology.

1. Application-Specific Integrated-MEMS Exchange (ASIM-X)
2. Coating and Surface Modification of Microstructures by Molecular Vapor Deposition and Photochemical Processing (MVD of FOTS), and (MVD of DDMS)
3. Commercial Diamond Thin-Film Processing Modules (standard) and (smooth) for the MEMS Exchange

As a special one time offer to allow our customers to test out these exciting new process capabilities, the MEMS and Nanotechnology Exchange in conjunction with the participating foundries will make process runs available to selected members of the domestic community at no cost (*). Parties interested in this opportunity will need to notify us of their interest by completing:

• the form for Application-Specific Integrated-MEMS Exchange (ASIM-X),
• the form for Coating and Surface Modification of Microstructures by Molecular Vapor Deposition and Photochemical Processing, or
• the form for Commercial Diamond Thin-Film.

The MEMS and Nanotechnology Exchange will select interested organizations to participate in this offer. Persons or groups submitting a process run under this opportunity will be required to set up a customer account with the MEMS and Nanotechnology Exchange.

If you have any questions about these processes or the MEMS Exchange, please contact Dr. Michael A. Huff, the Director of the MEMS Exchange at mhuff@mems-exchange.org or 703-262-5318. This effort is being supported by the Defense Advanced Research Projects Agency (DARPA).