Photoresist coat (automated): View

on front Photoresist coat (automated)

Process characteristics:

Material

Perform prime

Include standard HDMS prime.

Thickness

Please you the following ranges:
AZ 5214: 1.4 .. 2.8um
AZ 9260: 6 .. 20um
Shipley 1813: 1.3um
Shipley 1827: 2.7um
Shipley 220: 1.5 .. 4.5 um

1.3 .. 20 µm

Batch size

Sides processed

either

Wafer size

Equipment

Equipment characteristics:

MOS clean

yes

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon on insulator, silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 800 µm