Plasma Bond Activation and Non-Aligned Prebonding |
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| Ambient Ambient to which substrate is exposed during processing |
trifluoromethane, oxygen, carbon tetrafluoride |
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| Batch sizes |
100 mm: 2 |
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| Wafer size |
|
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| Equipment |
Plasmalab MicroEtch |
| Equipment characteristics: |
| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer holder Device that holds the wafers during processing. |
aluminum chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon carbide, silicon, gallium arsenide |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
0 .. 1000 µm |
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MEMS and Nanotechnology Exchange