on front 5x i-line stepper photolithography |
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| Process characteristics: |
| Alignment tolerance Registration of CAD data to features on wafer |
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| Min feature size Minimum feature size in the design that will be written on the wafer. (the corresponding feature size on the mask should be 5 times larger.) |
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| Perform edge bead removal |
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| Perform hardbake Hardbake or UV stabilization is optional for AZ5214E only.
Neither hardbake nor UV stabilization is available for AZ 9245. |
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| Perform linewidth metrology Two measurement per wafer |
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| Perform microscope inspection 30 mins inspection per wafer |
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| Perform stylus profilometry One measurement per wafer, for features >40um in width. |
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| Resist thickness |
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| Batch size |
1 |
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| Design size Size of design on mask |
15.5 mm |
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| Magnification |
5 |
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| Wafer size |
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| Comments: |
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