|
|
| Magnification |
5 |
|---|
| Mask plate dimension |
5 inch |
|---|
| Min feature size |
0.8 µm |
|---|
| Resist thickness |
1.5 µm |
|---|
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
150 mm |
|---|
| Wafer size |
|
|---|
| Equipment |
GCA 8500 DSW I-Line 5x Stepper |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 150 mm: 25 |
|---|
| MOS clean |
no |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
450 .. 700 µm |
|---|
| Comments: |
|
MEMS and Nanotechnology Exchange