Thermocompression Bonding: View

Thermocompression Bonding

Process characteristics:

Bonding Ambient

Wafer size

Equipment

Equipment characteristics:

Batch sizes

100 mm: 2, 150 mm: 2

MOS clean

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat, no-flat

Wafer holder

Device that holds the wafers during processing.

metal chuck

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon, Corning 1737

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 1000 µm