logo
Sheet resistance measurement: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
   Electrical metrology
   Geometric metrology
   Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front
Sheet resistance measurement
Current 1e-06 .. 0.2 A
Materials silicon (doped), metal (category)
Sheet resistance 0.005 .. 1e+06 Ω/square
Sides processed either
Voltage 1e-06 .. 1 V
Wafer size
Wafer size
Equipment CDE ResMap 168 Resistivity measurement
Equipment characteristics:
Batch sizes 150 mm: 25
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 675 µm