Spectrophotometric film thickness measurement |
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| Process characteristics: |
| Material |
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| Film thickness |
5 .. 5000 nm |
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| Wafer size |
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| Equipment |
Nanometrics NanoSpec |
| Equipment characteristics: |
| Batch sizes |
100 .. 150 mm: 1 |
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| MOS clean |
yes |
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| Piece dimension Range of wafer piece dimensions the equipment can accept |
2 .. 150 mm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
300 .. 2000 µm |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator, fused silica |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 900 µm |
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