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| Process characteristics: |
| Duration Duration os SEM inspection |
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| Batch size |
1 |
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| Magnifications |
100 .. 500000 |
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| Sides inspected The sides of the wafer inspected by the process |
either |
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| Wafer size |
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| Equipment |
Hitachi 4700 FE |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
2 .. 150 mm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 2000 µm |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 2000 µm |
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MEMS and Nanotechnology Exchange