|
|
| Line width |
1 .. 40 µm |
|---|
| Magnifications |
5, 10, 20, 50, 100 |
|---|
| Materials |
photoresist on silicon nitride, silicon dioxide, silicon nitride on silicon, photoresist on silicon dioxide, photoresist on silicon, silicon nitride on silicon dioxide |
|---|
| Wafer size |
|
|---|
| Equipment |
Nikon L-200 microscope |
| Equipment characteristics: |
| Batch sizes |
100 .. 200 mm: 1 |
|---|
| MOS clean |
no |
|---|
| Piece dimension Range of wafer piece dimensions the equipment can accept |
2 .. 150 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
300 .. 675 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, fused silica, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 675 µm |
|---|
MEMS and Nanotechnology Exchange