on front Photoresist coat (AZ HiR 1075) |
|---|
|
| Process characteristics: |
| Thickness |
|
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| Material |
AZ HiR 1075 |
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| Sides processed |
either |
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| Temperature |
90 .. 120 °C |
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| Wafer size |
|
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| Equipment |
TEL Mark VII Coater and Developer |
| Equipment characteristics: |
| Batch sizes |
150 mm: 1 |
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| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
fused silica, Corning Eagle 2000, silicon, Corning 1737, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 675 µm |
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