on front 5X stepper alignment and i-line exposure |
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|
| Magnification |
5 |
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| Material |
Arch OiR 897-10i |
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| Max field size |
10 mm |
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| Min feature size |
1 µm |
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| Setup time |
30 min |
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| Sides processed |
either |
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| Wavelength Wavelength of light used during the exposure |
365 nm |
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| Wafer size |
|
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| Equipment |
GCA 8500 wafer stepper (5x i-line) |
| Equipment characteristics: |
| Batch sizes |
150 mm: 1 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
500 .. 700 µm |
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MEMS and Nanotechnology Exchange