|
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| Excluded materials |
gold (category), copper |
|---|
| Process duration |
120 min |
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| Sides processed |
both |
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| Temperature |
80 °C |
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| Wafer size |
|
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| Equipment |
Wet bench #1 |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 150 mm: 25, 200 mm: 25 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
274 .. 900 µm |
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MEMS and Nanotechnology Exchange