Spectrophotometric film thickness measurement: View

on front Spectrophotometric film thickness measurement

Materials

polyimide on silicon, phosphosilicate glass on silicon, photoresist on silicon dioxide, borophosphosilicate glass on silicon, silicon nitride on silicon, photoresist on silicon nitride, photoresist on quartz, amorphous silicon on quartz, silicon dioxide on silicon, polyimide on silicon nitride, polysilicon on silicon dioxide, platinum on silicon dioxide, amorphous silicon on silicon, silicon nitride on quartz, amorphous silicon on silicon dioxide, photoresist on silicon

Sides processed

either

Thickness

20 .. 5000 nm

Wafer size

Equipment

Nanometrics NanoSpec

Equipment characteristics:

Batch sizes

100 mm: 1, 150 mm: 1

Piece dimension

Range of wafer piece dimensions the equipment can accept

2 .. 150 mm

Piece geometry

Geometry of wafer pieces the equipment can accept

triangular shard, other, rectangular, irregular, circular

Piece thickness

Range of wafer piece thickness the equipment can accept

300 .. 2000 µm

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat, notched, no-flat

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon on insulator, silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

300 .. 2000 µm

Extra terms

No materials with Gold contamination will be processed at this fab site. Certain services (for example, oxidation, diffusion, and sputter deposition) will be provided if wafers are virgin, or all pre-processing steps have been performed at this fab site.