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Polyimide deposition and pattern: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
   Evaporation
   LPCVD
   Low-stress SiN deposition
   Miscellaneous deposition
   Oxidation
   PECVD
   Spin casting
   Sputtering
Doping
Etch
LIGA
Lift off
Lithography
   Contact mask lithography
   Maskless lithography
   Miscellaneous lithography
   Projection mask lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

Polyimide deposition and pattern
Batch sizes 100 mm: 12, 150 mm: 12
Material PI2771
Min feature size 10 µm
Photoresist polarity negative
Temperature 350 °C
Thickness 5 .. 6 µm
Wafer size
Wafer size
Equipment
Comments:
  • PI-2771 is a NEGATIVE tone photodefinable polyimide.
  • Processing steps are as follows:
    1. Dehydration bake: 30 min in VWR oven
    2. Manual PR spin coat
    3. Softbake: 90s at 90 C
    4. Lithography Exposure - KS Aligner
    5. Post-Exposure Bake
    6. Develop - G-line PR developer
    7. Cure - Oven at 375C, 60 min
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