on front Photoresist coat (Shipley 220) |
|---|
|
| Material |
Shipley SPR220-7 |
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| Sides processed |
either |
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| Thickness |
10 µm |
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| Wafer size |
|
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| Equipment |
SVG 8600 Photoresist Coat Track |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 700 µm |
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MEMS and Nanotechnology Exchange