Contact photolithography (Image reversal): View

on front Contact photolithography (Image reversal)

Material	HMDS

on front

Material	AZ P4400

Material	photoresist (category)

on front

on front

Material	AZ P4400

on front

Material	photoresist (category)

Process characteristics:

Alignment side

Perform descum

To clean the photoresist residue in open areas

Perform hard bake

Please select "no" if this module will be used for a lift-off operation.

Resist thickness

Batch size 1

Feature geometry

Shape of feature with dimensions characterized by the minimum feature size

equal line space

Field geometry

Shape of field with dimensions characterized by the maximum field size

circle

Magnification 1

Materials AZ 4620, AZ P4400

Max field size 150 mm

Min feature size 1 .. 5 µm

Photoresist polarity positive

Wafer size

Comments:

This is an image reveral photolithography that yields negative photoresist profile ideal for lift-off processes.
See http://www.mems-exchange.org/users/litho-templates for information about layout requirements.

Attachments