Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Tantalum anodization Down
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  1 Tantalum DC Magnetron Sputtering
Materialtantalum
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  2 Tantalum Anodization Down
Materialtantalum oxide
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  3 Stylus Profilometer Step Measurement
Process characteristics:
Perform stylus profilometry
Perform stylus profilometry*
yes no
Thickness
Thickness*
must be 1600 .. 2800 Å
1600 .. 2800 Å
Voltage
Voltage*
must be 100 .. 175 V
100 .. 175 V
Material tantalum oxide
Wafer size
Wafer size
Comments:
  • We recommend blanket Ta anodization.