G-line resist develop (AZ4000) |
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| Batch size |
12 |
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| Duration |
90 s |
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| Materials |
AZ 400K |
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| Sides processed |
both |
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| Wafer size |
|
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| Equipment |
wet bench |
| Equipment characteristics: |
| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), ceramic, Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
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MEMS and Nanotechnology Exchange