Spectrophotometric film thickness: View

on front Spectrophotometric film thickness

Materials

photoresist (G-line), photoresist (negative) on silicon dioxide, photoresist (positive) in silicon dioxide, polyimide on silicon, polysilicon on silicon dioxide, silicon dioxide on silicon, silicon nitride on silicon, silicon nitride on silicon dioxide

Sides processed

either

Thickness

100 .. 40000 Å

Wafer size

Equipment

Nanometrics CTS-102

Equipment characteristics:

Batch sizes

50 .. 125 mm: 1

MOS clean

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat, no-flat, notched

Wafer holder

Device that holds the wafers during processing.

recessed platen

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire, titanium

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 1000 µm