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Glass frit bonding: View
Process Hierarchy
Bonding
   Anodic bonding
   Fusion bonding
   Glass frit bonding
   Miscellaneous bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

Glass frit bonding
1 Glass frit printing/firing
2 Glass frit bonding (vacuum)
Process characteristics:
Alignment type
Method used to align materials to be bonded.
Alignment type*
Method used to align materials to be bonded.
Second substrate side bonded
Second substrate side bonded*
Substrate side bonded
Substrate side bonded
Alignment tolerance
Registration of CAD data to features on wafer
 10 µm
Batch size 2
Second substrate diameter 50 mm
Second substrate material Pyrex (Corning 7740)
Second substrate thickness 300 .. 1000 µm
Temperature 400 °C
Wafer size
Wafer size
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