Glass frit printing/firing |
|---|
|
| Alignment tolerance Registration of CAD data to features on wafer |
10 µm |
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| Min feature size |
150 µm |
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| Second substrate diameter |
100 mm |
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| Second substrate material |
Pyrex (Corning 7740) |
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| Second substrate thickness |
300 .. 1000 µm |
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| Temperature |
400 °C |
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| Wafer size |
|
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| Equipment |
screen printer |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1 |
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| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1000 µm |
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MEMS and Nanotechnology Exchange