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Resist bonding (Shipley 1827): View
Process Hierarchy
Bonding
   Anodic bonding
   Fusion bonding
   Glass frit bonding
   Miscellaneous bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

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Resist bonding (Shipley 1827)
MaterialHMDS
MaterialShipley 1827Thickness2.7 µm
Material Shipley 1827
Resist thickness 2.7 µm
Wafer size
Wafer size