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5X DUV photolithography : View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
   Contact mask lithography
   Maskless lithography
   Miscellaneous lithography
   Projection mask lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
   DUV Lithography
   Deep boron diffusion
   Hot Embossing
   LIGA
   Maskless lithography
   Microwave bonding
   Shape memory alloy deposition
   Silicon-germanium processes
   Supercritical dry
   Xenon difluoride etch

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front
5X DUV photolithography
1 Dehydration bake
2 HMDS Prime
MaterialHMDS
on front
3 DUV photoresist coat (Shipley UV210)
MaterialShipley UV210
4 DUV photoresist softbake
MaterialShipley UV210
on front
5 DUV Stepper front-front alignment
on front
6 DUV exposure
MaterialShipley UV210
7 DUV post-exposure bake
MaterialShipley UV210
on front
8 DUV develop (Shipley UV210)
MaterialShipley UV210
9 DUV photoresist hardbake
MaterialShipley UV210
Process characteristics:
Perform hard bake
Perform hard bake*
yes no
Resist thickness
Resist thickness*
Batch size 12
Magnification 5
Material Shipley UV210
Max field size 21 mm
Min feature size 0.35 µm
Wafer size
Wafer size
Comments:
Attachments
asml_fiducials.gds (76.0 KB, application/octet-stream)
Frame information
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