on front Contact photolithography (NR1-6000PY) |
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| Material | photoresist (category) |
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| Material | photoresist (category) |
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| Material | photoresist (category) |
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| Process characteristics: |
| Alignment side |
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| Perform backside protect |
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| Resist thickness |
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| Batch sizes |
75 .. 200 mm: 4 |
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| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
equal line space |
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| Field geometry Shape of field with dimensions characterized by the maximum field size |
circle |
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| Magnification |
1 |
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| Material |
NR1-6000PY |
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| Max field size |
200 mm |
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| Min feature size |
1 .. 5 µm |
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| Photoresist polarity |
negative |
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| Wafer diameter(s) List or range of wafer diameters the tool can accept |
75 .. 200 mm |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon, silicon on insulator |
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| Wafer size |
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| Comments: |
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MEMS and Nanotechnology Exchange