Anodic bonding (air, with alignment): View

Process Hierarchy

Anodic bonding (air, with alignment)

Alignment type

Method used to align materials to be bonded.

optical

Ambient

Ambient to which substrate is exposed during processing

air

Batch size

Bonded materials

Pair of materials bonded by this process

glass (Hoya), Pyrex (Corning 7740), silicon

Pressure

Pressure of process chamber during processing

1 atm

Wafer size

Comments:

Note that 150 mm wafer is not cleaned completely in this tool. The megasonic head does not go to the wafer edge, so only about 80% of the wafer is cleaned from the center out.