Chromium DC-magnetron sputtering (high power): View

on front Chromium DC-magnetron sputtering (high power)

on front

1 Chromium DC-magnetron sputtering (high power)

Material	chromium	Residual stress	93 MPa

on front

2 Stylus profilometer step measurement

Depth	100 µm

Process characteristics:

Thickness

Amount of material added to a wafer

0.1 .. 2 µm

Excluded materials

gold (category), copper

Material

chromium

Wafer size

Comments:

Film thickness measurements are performed by stylus profilometry. A separate, partially-masked substrate is loaded along with each wafer and is used to measure the thickness of the as-deposited film.

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.