on front X-ray front-front align |
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| Alignment tolerance Registration of CAD data to features on wafer |
2 µm |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
X-ray beam line |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
stainless steel |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), metal (category), Pyrex (Corning 7740), quartz (single crystal), silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
500 .. 1000 µm |
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MEMS and Nanotechnology Exchange