on front Photoresist coat (Shipley 1827) |
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|
| Batch size |
1 |
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| Material |
Shipley 1827 |
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| Sides processed |
either |
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| Thickness |
2.7 µm |
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| Wafer size |
|
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| Equipment |
Solitec photoresist spinner |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
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| Wafer holder Device that holds the wafers during processing. |
metal chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (single crystal), silicon on insulator, silicon, Pyrex (Corning 7740) |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |
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MEMS and Nanotechnology Exchange