Photoresist coat (spoke pattern Shipley 1827): View

Process Hierarchy

LPCVD

PECVD

on front Photoresist coat (spoke pattern Shipley 1827)

Batch size

Material

Shipley 1827

Sides processed

either

Thickness

2.7 µm

Wafer size

Equipment

Equipment characteristics:

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon, glass (category)

Wafer thickness

List or range of wafer thicknesses the tool can accept

50 .. 1000 µm

Comments:

Spoke pattern resist coat for resist bonding (allows gas to escape from bonded area).