Resist hardening: View

on front Resist hardening

Batch size

Pressure

Pressure of process chamber during processing

760 Torr

Process duration

75 min

Sides processed

either

Temperature

110 °C

Wafer size

Equipment

Equipment characteristics:

Wafer holder

Device that holds the wafers during processing.

plate

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon, silicon germanium, silicon on insulator, quartz (single crystal)

Wafer thickness

List or range of wafer thicknesses the tool can accept

300 .. 700 µm

Comments:

Photoresist hardening must be performed before etching in AMT 8100 to avoid resist burning.