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| Process characteristics: |
| Blade thickness 40 um metal, 100um resin |
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| Cuts per wafer Number of cuts per wafer |
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| Die length Length of die. |
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| Die width Width of die. |
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| Wafer size |
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| Equipment |
Dicing Saw |
| Equipment characteristics: |
| Batch sizes |
50 .. 100 mm: 1 |
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| MOS clean |
no |
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| Piece dimension Range of wafer piece dimensions the equipment can accept |
10 .. 100 mm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
0.25 .. 511 mil |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
metal chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, fused silica, Pyrex (Corning 7740), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
0.25 .. 511 mil |
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| Comments: |
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MEMS and Nanotechnology Exchange