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Non-contact sheet resistance measurement: View
Process Hierarchy
Bonding
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Deposition
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Etch
LIGA
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If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

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Non-contact sheet resistance measurement
Process characteristics:
Film thickness
Thickness of measured layer.
Film thickness
Thickness of measured layer.
unconstrained
Material
Material to measure sheet resistance on.
Material
Material to measure sheet resistance on.
Temperature
Specify preferred measurement temperature (if known).
Temperature
Specify preferred measurement temperature (if known).
unconstrained
Sides inspected
The sides of the wafer inspected by the process
 either
Equipment
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