|
|
| Batch size |
25 |
|---|
| Etch rate |
0.8 µm/min |
|---|
| Etchant Solutions and their concentrations. |
PRS 2000 |
|---|
| Material |
photoresist (category) |
|---|
| Sides processed |
both |
|---|
| Temperature |
65 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Solvent wet bench |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
teflon carrier |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
|---|
| Comments: |
|
MEMS and Nanotechnology Exchange