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Wafer dicing: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
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Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

Wafer dicing
Process characteristics:
Cuts per wafer
Number of cuts per wafer
Cuts per wafer
Number of cuts per wafer , must be 1 .. 100
1 .. 100
Die length
Length of die.
Die length*
Length of die., must be 50 .. 100000 µm
50 .. 100000 µm
Die separation (X-direction)
Die separation on wafer.
Die separation (X-direction)*
Die separation on wafer., must be 50 .. 100000 µm
50 .. 100000 µm
Die width
Width of die.
Die width*
Width of die., must be 50 .. 100000 µm
50 .. 100000 µm
Wafer size
Wafer size
Equipment Microautomation 1006 Dicing Saw
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
 metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 25 .. 1000 µm
Comments:
  • Send dicing information by e-mail. Include dicing diagram or sufficiently detailed description. State alignment, street width and angle. Alignment to primary flat available.
  • Extra charge for thick substrates (over 500µm) or unusually thin substrates (under 100µm)
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