Resist bond: View

MEMS and Nanotechnology Exchange

Process Hierarchy
Bonding
Anodic bonding
Fusion bonding
Glass frit bonding
Miscellaneous bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

Resist bond

Batch size

Wafer size

Equipment

Silicon organic wet bench

Equipment characteristics:

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon, glass (category)

Wafer thickness

List or range of wafer thicknesses the tool can accept

50 .. 1000 µm

Comments:

Wafers brought into contact, no alignment.