I-line photoresist coat (OiR 897 10i): View

on front I-line photoresist coat (OiR 897 10i)

Process characteristics:

Thickness

Amount of material added to a wafer

Deposition rate

Rate at which material is added to a wafer

1 µm/min

Material

Arch OiR 897-10i

Setup time

30 min

Sides processed

either

Temperature

23 °C

Wafer size

Equipment

Equipment characteristics:

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat

Wafer holder

Device that holds the wafers during processing.

vacuum chuck

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

300 .. 700 µm