on front Stylus profilometer step measurement |
|---|
|
| Batch size |
1 |
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| Contact force Force applied at contact point |
5 mN |
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| Depth |
2000 µm |
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| Measurement aspect |
thickness |
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| Measurement unit |
nm |
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| Setup time |
20 min |
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| Sides inspected The sides of the wafer inspected by the process |
either |
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| Wafer size |
|
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| Equipment |
KLA-Tencor Alpha-Step IQ surface profiler |
| Equipment characteristics: |
| MOS clean |
no |
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| Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 100 mm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
irregular, other, rectangular |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
0.3 .. 21 mm |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
aluminum plate |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), Pyrex (Corning 7740), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
0.3 .. 21 mm |
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MEMS and Nanotechnology Exchange