|
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| Batch size |
1 |
|---|
| Process duration |
5 min |
|---|
| Temperature |
20 °C |
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| Wafer size |
|
|---|
| Equipment |
Ultrasonic Cleaner |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
teflon cassette |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, Borofloat (Schott), glass (category), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 500 µm |
|---|
MEMS and Nanotechnology Exchange