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Wafer dicing: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

Wafer dicing
Process characteristics:
Blade thickness
40 um metal, 100um resin
Blade thickness
40 um metal, 100um resin
Cuts per wafer
Number of cuts per wafer
Cuts per wafer
Number of cuts per wafer , must be 1 .. 100
1 .. 100
Die length
Length of die.
Die length*
Length of die., must be 50 .. 100000 µm
50 .. 100000 µm
Die separation (X-direction)
Die separation on wafer.
Die separation (X-direction)*
Die separation on wafer., must be 150 .. 100000 µm
150 .. 100000 µm
Die width
Width of die.
Die width*
Width of die., must be 50 .. 100000 µm
50 .. 100000 µm
Excluded materials gold (category), copper
Wafer size
Wafer size
Equipment Wafer dicing saw
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 50 mm: 1
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, glass (category), Pyrex (Corning 7740), silicon
Comments:
  • Send dicing information. Include dicing diagram and detailed description, alignment, street width, thickness left, etc.
  • There will be an additional charge for materials which cause blades to break prematurely.
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.
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